SYNC 200 embedded boards are system on module based protocol converter suitable for OEMs to embed the hardware in their existing relays, RTUs, Sensors, and IEDs to upgrade the product to the latest Smart Grid substation and metering protocols (DNP3, IEC 104, IEC 101, MQTT, IEC 61850, GOOSE, DLMS) with minimum R&D effort and time
The advent of superior communication protocols like the one according to IEC 61850 standard, demanded Intelligent Electronic Devices (IEDs) to be complying to these standards for substation automation requirements. Legacy devices, which are functionally superior and acceptable to utility and industrial customers, had to go out of market, because those do not the newer protocols. SYNC200 series of embedded chip products act as upgrade cards for incorporating latest smart grid substation and metering protocols in existing IED equipment design.
SYNC200 series of modules offer the IED manufacturers the ability to upgrade to support almost any protocol like IEC 61850, DNP3.0, IEC 608570-5-101 / 103 / 104 and DLMS/COSEM with minimal change in product design, enabling faster go-to-market, while saving on R&D and product development costs. The major R&D efforts in upgrading to the latest protocols is already take care in the SYNC200 modules, thereby enabling the device manufacturers to focus on their core strengths with minimal efforts on the adaptation to newer protocols.
SYNC200 can be embedded in various devices like Protection Relays, Energy Meters, Mini RTUs, Transformer Monitoring Systems, PLCs, Switch gears and Alarm Annunciators, and is being used under long term agreements at more than 30 customer locations worldwide.
SYNC200 modules are specifically designed for power industry applications, with superior processing capabilities as well as numerous interfacing options. SYNC200 has been tested to withstand stringent temperature and environmental variations and has proved successful in a variety of industry and utility segments. SYNC200 modules are suited for high performance IEC 61850 requirements and can be used for General Purpose Input / Output (GPIO) and Generic Object Oriented Substation Events (GOOSE) based high-speed messaging. Numerous products using SYNC200 series embedded boards have been certified at DNV (formerly KEMA) and CPRI test labs by various customers.
SYNC200 provides not just one-to-one protocol conversion, but also many-to-many protocol conversion and supports numerous protocols. Moreover, the small size and the various interfacing mechanisms like TTL, I2C, SPI and GPIO make it ideal for a large variety of products and applications.
Kalkitech has developed a Developer Kit to enable the user to test and integrate the SYNC200 modules with end devices quickly and with minimal costs. The Developer Kit is packaged with the necessary development board, sample SYNC200 modules hardware, configuration tools, documentation, and 20 hours of technical support.
Kalkitech can also provide support for IEC 61850 Level A certification of customer devices from certification agencies like DNV, CPRI etc., built on its expertise in IEC 61850 and product management.
SYNC 200 series are available in numerous models for varying ports, performance and dimension requirements.
SYNC 211: One serial and one Ethernet port for low scale protocol conversion; very small form factor. It is an ultra-compact embedded module with an ARM7 based processor, one 10/100 Base T Ethernet network interface, and one TTL serial interface. SYNC 211 enables future-proofing of legacy devices at an attractive price-point. Dimensions: 36.7 mmx 19.05 mm x 21.69 mm
SYNC 221: Two serial ports and one Ethernet port for medium/high duty protocol conversion like IEC 61850; small form factor. SYNC 221 is designed for the flexibility and performance requirements of small but powerful devices like RTUs and Relays. It has two TTL serial interfaces and one 10/100 Base T Ethernet interface. Dimensions: 45mm x 40mm x 21.6mm.
SYNC 241: Four serial ports and one Ethernet port (Copper or Fibre Optic port version available) for medium/high duty protocol conversion like IEC 61850; medium form factor. SYNC 241 offers the scalability of 4 TTL interfaces and one 10/100 Base T network interface as well as support for up to 20GPIOs, all in a form factor that is suitable for most applications. Dimensions:55.4mm x62.2mm x 24mmSYNC 241has two variants: SYNC 241 Copper and SYNC 241 FO. The SYNC 241 Copper provides the same functionality as the SYNC 241FOand differs only in size. Dimensions: 55.4mm x 62.2mm x36mm mm.TheSYNC241 FO, on the other hand, will have one fiber optic (FO) interface instead of the one 10/100 Base T network interface. Dimensions:55.4mm x 62.2mm x 32mm
SYNC 261: Four serial ports and two Ethernet ports (Copper port version available) for medium/high duty protocol conversion like IEC 61850; medium form factor.
SYNC 261 offers the scalability of 4 TTL interfaces and two 10/100 Base T network interface as well as support for up to 20 GPIOs, all in a form factor that is suitable for most applications. SYNC 261 powered with a high-end processor, is ideal for modern automation systems. The module has dual redundant communication link, which supports PRP, bonding/teaming and can be used for various applications apart from protocol conversion, IEC 61131 based logic engine, web-based monitoring systems. The module also supports IEEE1588 (PTP) based time-synchronization. Dimensions: 55mm x 50mm x 9mm (base board only)
